Motivair Cool News

The data center industry is on the brink of a significant transformation, driven by the adoption of liquid cooling technology. According to a recent report from Dell’Oro Group, the data center liquid cooling market is expected to surpass $15 billion over the next five years, marking a transition from niche to mainstream adoption. Among the leading vendors, Motivair has emerged as a top player, reflecting the market's competitive landscape and innovation.

Driving Factors for Liquid Cooling Adoption

Efficiency and Thermal Management

Historically, liquid cooling has been promoted for its efficiency and sustainability benefits. However, the primary driver for its current adoption surge is its superior thermal management capabilities. As Lucas Beran, Research Director at Dell’Oro Group, notes, "Increased thermal management performance for high-end processors and accelerated servers is now the key factor behind liquid cooling adoption."

Leading Technologies and Vendors

Single-phase direct-to-chip liquid cooling (DLC) is leading the charge, thanks to its established presence in high-performance computing (HPC) and endorsement by industry giants like NVIDIA. Motivair's prominence in this market highlights their significant contributions to these technological advancements.

Market Segments and Growth Projections

Enterprise vs. Service Providers

The enterprise segment, particularly HPC, was the leading customer for liquid cooling in 2023. However, the service provider segment, including major cloud and colocation providers, is expected to outpace enterprise growth significantly through 2028.

Emerging Technologies

While single-phase DLC remains dominant, other technologies like single-phase immersion and two-phase DLC are also gaining traction. Despite regulatory challenges, two-phase immersion cooling is undergoing significant testing and validation.

Transforming Data Center Efficiency

Liquid cooling is set to revolutionize data center thermal management. Unlike air cooling, liquid cooling excels in heat dissipation, ideal for modern data centers with high-wattage processors. Motivair provides customers with a comprehensive end-to-end portfolio from a single source, offering products, systems, and services, tailored for tomorrow’s toughest thermal challenges.

• Coolant Distribution Units (CDUs): Cooling capacity from 105kW to 2.3MW, supporting advances in AI processors.

• The ChilledDoor®, Rear Door Heat Exchangers (RDHx): Air-assisted liquid cooling for high-wattage processors, providing on-demand cooling.

• Dynamic® Cold Plates: Scalable technology for thermal performance up to +1,500 watts per processor.

• In-Rack Manifolds: Custom stainless-steel manifolds interfacing cold plate loops and CDUs.

The report highlights the growing diversity in cooling solutions, with air-assisted liquid cooling and liquid-to-liquid heat exchange expected to grow significantly. By 2028, these methods are projected to constitute over a third of the data center thermal management market.

Learn more: HPCWire | Data Center Frontier | NetworkWorld