Motivair's Dynamic® Cold Plate technology represents the future of liquid cooling for AI and data centers. Engineered for superior chip-level cooling, our solution delivers robust thermal performance while minimizing the risk of fluid contamination and supply chain disruptions.
Motivair's Dynamic® Cold Plate utilizes advanced fluid dynamics to revolutionize direct liquid cooling. Our patented technology ensures exceptional performance, allowing CPUs, GPUs, and FPGAs to operate at peak efficiency while minimizing the risk of cooling degradation and costly system failures.
The innovative design of the Dynamic® Cold Plate prevents the buildup of system particles by maintaining a free-flowing coolant, which enhances reliability and longevity.
This straightforward yet highly effective technology is optimized for cost-efficient and scalable production, targeting High-Performance Computing (HPC), small to large clusters, and Exascale-class systems.
All products are engineered and manufactured in the USA, providing a reliable, end-to-end experience and mitigating the risks associated with foreign supply chain disruptions.
As the demand for e-commerce, big data, and artificial intelligence continues to soar, businesses must harness high-performance computing to meet these growing challenges.
Every technological breakthrough or data center upgrade brings a new power requirement to fuel innovation. Modern CPUs and GPUs now consume over 300 watts, with future models projected to use between 500 and 750 watts—and some packages already exceed 1,000 watts.
Air cooling has reached its limits. As liquid cooling emerges as the dominant solution for thermal challenges, implementing an effective end-to-end cooling strategy is more critical than ever.