In-Rack Manifold
Direct-to-Chip Liquid Cooling
In-Rack Manifold
Optimize Liquid Cooling with Motivair’s
In-Rack Manifolds
Seamless Integration for High-Efficiency Cooling
Motivair’s In-Rack Manifolds are designed to streamline the connection between your cooling infrastructure and Motivair’s Dynamic Cold Plates™, ensuring a smooth and efficient liquid cooling process.
By providing a common connection point between the Dynamic Cold Plates™ and your supply and return cooling infrastructure system or Coolant Distribution Unit (CDU), these manifolds play a critical role in maintaining optimal performance and reliability in high-density computing environments.
Precision Engineering for Enhanced Performance
Built from durable 304 stainless steel, Motivair’s In-Rack Manifolds are engineered to withstand the demanding conditions of modern data centers. The robust construction ensures long-term reliability, even in the most intensive cooling applications.- Available in various sizes, including: 42U, 48U, 50U, and custom configurations
- Universal top/bottom design enhances compatibility, allowing for seamless integration into any rack configuration, whether in a new build or an upgrade to an existing system.
Streamlined Liquid Cooling Efficiency
The In-Rack Manifold plays a vital role in optimizing liquid cooling by centralizing connection points, simplifying installation, and reducing maintenance complexity. This design minimizes leak risks and enhances system reliability, crucial for maintaining uptime in high-performance environments.
By improving coolant distribution, the manifold ensures precise temperature control, delivering targeted cooling exactly where it’s needed to prevent performance issues or hardware failures.
Learn more: How In-Rack Manifolds Impact Your HPC System
