Motivair Cool News

Motivair by Schneider Electric is a global leader in liquid cooling for AI and high-performance computing. With The International Conference for High Performance Computing, Networking, Storage, and Analysis bringing the HPC community together in St. Louis from November 16–20 for a week of innovation and collaboration, we’re excited to showcase the industry’s most advanced cooling solutions purpose-built for the AI era.

Visit us at Booth #1127 to see how Motivair is redefining thermal performance for the next generation of data centers.

Join Us at Our Exhibit

Motivair invites SC25 attendees to discover how End- to- End Liquid Cooling Portfolio is purpose built for the accelerating demands of AI and HPC. Whether designing new AI factories or upgrading existing compute environments, we help customers scale faster, operate smarter, and achieve stronger long-term value.

Motivair integrates liquid cooling with optimized electrical infrastructure to deliver seamless performance. Combined with Schneider Electric’s proven reference designs and digital twin tools, these solutions accelerate deployment and reduce uncertainty. Intelligent software enhances efficiency and reliability in live operations, while expert service support ensures continuity, safety, and long-term return on investment.

Motivair delivers liquid cooling that keeps pace with innovation, enabling the performance breakthroughs driving the future of advanced computing.

See the Next Generation IT Pod at Booth 1127

SC25 attendees will have the opportunity to explore a prefabricated modular IT Pod designed by Schneider Electric and enabled by Motivair liquid cooling. It is a factory-built solution that integrates power and cooling into a single scalable module suited for high density AI environments.

This Pod supports up to 40+ racks with hybrid liquid and air cooling to meet the thermal requirements of today’s GPU architectures. Preconfigured and factory tested, it delivers predictable performance with faster deployment, reduced risk, and lower capital expense. Each module is shipped partially assembled to accelerate installation and minimize disruption on site.

Key Capabilities

• Scalable design to meet the latest generation of AI workloads
• Rack capacity: up to 42
• Power per rack: 132 kW plus
• Total Pod power: 1.2 MW plus
• Purpose built for hyperscale, cloud, and large AI deployments

This Pod demonstrates how unified power and liquid cooling architecture shortens time to value, increases compute density, and prepares data centers for the demands of accelerated computing.

Our Technology at SC25

Highlights of Motivair’s Solutions

• The Widest Range of Coolant Distribution Units (CDUs)
  Trusted by leading data centers and HPC facilities to cool up to 2.3 MW. Designed in alignment with next generation processors and accelerators for seamless integration.
• Motivair ChilledDoor®
  A rear door heat exchanger supporting rack densities up to 75 kW. Ideal for GPU powered systems including AI training clusters. Rack agnostic for fast adoption in any HPC setting.

Motivair and Schneider Electric are the industry’s only end-to-end provider of liquid cooling solutions purpose built for accelerated computing. Our proven experience cooling the world’s most advanced HPC and exascale systems has positioned us to support what comes next.

We look forward to connecting with you in St. Louis and proving what is possible when cooling unlocks the full power of accelerated computing.

For more information or to register visit https://sc25.supercomputing.org/