Motivair Cool News

ST. LOUIS, Nov. 12, 2021 — Motivair Corporation, a global leader and innovator in cooling digital infrastructure, will showcase its portfolio of Dynamic Cold Plates for CPU, GPU, and FPGAs at SC21, the international conference for high performance computing, networking, storage, and analysis. Attendees can also visit booth #2601 to learn more about Motivair’s In-Rack Heat Dissipation Unit(HDU) and its comprehensive End-to-End Liquid Cooling Portfolio designed exclusively for HPC, AI and Big Data users.

“With chip processing power rapidly expanding, we’re making sure our global clients have access to reliable, scalable direct liquid cooling that can meet their needs now and into the future,” said CEO Rich Whitmore.

Dynamic Cold Plates

Motivair’s Dynamic Cold Plates deliver robust and scalable thermal performance up to 1000 watts per processor. The patent pending technology allows CPUs, GPUs, and FPGAs to operate at peak performance without the use of skived microchannels.

In-Rack Heat Dissipation Unit(HDU)

Motivair’s In-Rack HDU delivers mission-critical liquid cooling where facility water is not available. This unit circulates fluid to direct liquid-cooled cold plate technology, cooling designated chips and rejecting removed heat to the surrounding air. Its compact footprint and caster mounted design allow you to move it to selected test stand areas as needed. It is also designed to mount into a rack and operate in a production data center environment.

Custom End-to-End Cooling Systems

Motivair’s End-to-End Liquid Cooling Systems provide customers with all-in-one direct liquid cooling solution. All products, including Coolant Distribution Units(CDUs), Heat Dissipation Units, custom stainless steel In-Rack Manifolds, Memory Cooling, Quick Connects and Hose Systems, are designed and manufactured in the USA for the world’s most advanced HPC, AI and Exascale-class systems.

Additional Information Available at SC21

• The Widest Range of CDUs: Cool up to 2.3MW with Motivair’s portfolio of CDUs. Motivair’s CDUs represent the widest range and highest capacity standard and custom OEM CDUs available.
• Motivair’s ChilledDoor®: an active rear-door heat exchanger that cools rack densities up to 75 kW per rack. It is a leader in high efficiency and high-density server rack cooling systems for small, medium, and larger data centers.

Motivair’s diverse range of Liquid Cooling and Data Center & IT Cooling technology provides mission critical businesses and innovation leaders reliable cooling technology and digital infrastructure shaping our world. Its technologies are featured in numerous Top500 supercomputers around the globe. For more information on Motivair, visit motivaircorp.com.

About Motivair Corporation

Motivair enables industry leaders to push the boundaries of what’s possible by leveraging over 30 years of insights and innovations creating dependable mission critical cooling systems. Based in Buffalo, NY, Motivair creates, develops, and manufactures a portfolio of specialty chillers and high-density computer cooling systems that cool vital industries and propel the world’s most complex and advanced technologies. Its technologies are featured in numerous Top500 supercomputers around the globe. For more information, visit www.MotivairCorp.com.