Motivair Cool News

Motivair by Schneider Electric, a global leader in liquid cooling for AI and high-performance computing, is excited to once again be part of the International Conference for High Performance Computing, Networking, Storage, and Analysis from November 16–20 in Chicago, IL.

Join Us at Booth 3823

Motivair invites attendees to visit Booth 3823 to discover how our end-to-end liquid cooling portfolio can keep up with the evolving demands of AI. Whether the goal is to design a new data center or simply to upgrade existing compute environment, Motivair is here to help customers experience consistent performance, operate more efficiently, and achieve long-term operational reliability.

Visitors to the booth will have the opportunity to join guided tours and discover how Motivair and Schneider Electric can connect power, cooling, digital infrastructure, and services into scalable data center architecture.

See Our Technology

Visitors to the booth will get a firsthand look at the following products from the Motivair portfolio:

Coolant distribution unit (CDU)
Prepare for the next generation of AI with the Motivair by Schneider Electric range of CDUs, designed to deliver precise coolant flow so IT infrastructure operates reliably, efficiently, and at scale. The heart of a liquid cooling system, the CDU connects liquid-cooled servers to existing facility cooling systems.

ChilledDoor®
Our rear door heat exchanger removes 100% of heat from rack densities up to 75kW, directly at the rack level. The ChilledDoor’s rack agnostic architecture makes it easy to deploy in any standard high-performance computing environment.

Heat Dissipation Unit (HDU™)
For those data centers that don’t have facility water available, the HDU is a practical bridge product that supports liquid-cooled servers in existing air-cooled operations. Operators can deploy liquid cooling without making costly infrastructure changes to their facilities.

In addition to Motivair technology, booth visitors can interact with Schneider Electric’s AI factory portfolio, including:

Reference designs for high-density environments
Pre-validated, fully engineered blueprints that define how power, cooling, and IT infrastructure should be organized to build a reliable, scalable, and AI-ready data center.

Modular IT pod deployments
Prefabricated pods for AI environments that integrate racks, power, and cooling.

Digital twins and simulation technologies
AVEVA and ETAP digital twin models and NVIDIA Omniverse allow teams to evaluate electrical capacity, thermal behavior, airflow, and control strategies before data center construction even begins.

AI-enabled operational software
The intelligence layer of data center deployment that enables operators to control, optimize, and scale AI factories in real time.

We’re Ready to Connect

We’re excited to connect with SC26 attendees in Chicago this November and provide a firsthand look at what can be possible with liquid cooling solutions that scale alongside AI.

For more information or to register, visit the SC26 website.