Motivair Cool News

HAMBURG – Motivair by Schneider Electric, a global leader and innovator in cooling digital infrastructure, will showcase its portfolio of direct liquid cooling technology June 10-12 at Booth B10/11 at ISC High Performance 2025, an international conference and exhibition that fosters the growth of a global HPC community of technology providers and users.

Featured Products for review at the Motivair by Schneider Electric Booth
Attendees can view a range of solutions from the company’s End-to-End Liquid Cooling Portfolio, designed exclusively for HPC, artificial intelligence, and Big Data users:

• Coolant Distribution Units (CDUs)
  Boasting the widest range in the industry—featured in all three USA Exascale Systems—Motivair by Schneider Electric’s CDUs cool up to 2.3MW. They are designed to enable the latest advances in AI from NVIDIA and AMD processors.
• The ChilledDoor®
  A server- and rack-agnostic active rear-door heat exchanger that cools rack densities up to 75 kW. Ideal for air-cooled, high-wattage processors like NVIDIA’s H100, Intel’s Ice Lake, and Sapphire Rapids.
• Liquid-to-Air Heat Dissipation Unit (HDU™)
  An innovative product that bridges the gap between liquid-cooled hardware (e.g., NVIDIA GPUs) and air-cooled data centers. It’s perfect for AI accelerator boxes, colocation environments, or labs where water is not readily available.

About Motivair by Schneider Electric
Motivair by Schneider Electric designs, engineers, and services liquid cooling and data center cooling infrastructure that enables advanced technologies for tomorrow. The company supports the progressive needs of customers ranging from AI and edge computing to colocation and hyperscale data centers, as well as other mission-critical applications. Its technologies are used by leading silicon manufacturers, server OEMs, and data centers and are featured in numerous Top500 supercomputers worldwide.