AI infrastructure is evolving rapidly, and the demands on data center cooling, power, and scalability continue to accelerate alongside it.
From June 2–5, Schneider Electric will be exhibiting at COMPUTEX Taipei 2026, bringing together experts across the AI infrastructure ecosystem to showcase how organizations can design, deploy, and scale high-density environments with confidence.
As part of Schneider Electric’s presence at the event, Motivair by Schneider Electric experts will be onsite to discuss the growing role of advanced liquid cooling technologies in supporting next-generation AI deployments. Attendees will have the opportunity to connect directly with our team to explore strategies around scalable cooling infrastructure, deployment efficiency, operational reliability, and supporting higher-density compute environments.
Visitors to the Schneider Electric booth will experience guided tours focused on end-to-end AI infrastructure solutions, spanning everything from grid to chip and chip to chiller. The tours will highlight innovations across power, cooling, software, services, and lifecycle management designed to help organizations move from AI ambition to real-world execution.
📅 June 2–5, 2026
🕛 Guided Booth Tours: 11:00–11:30 AM & 3:00–3:30 PM
📍 Taipei Nangang Exhibition Center, Hall 1, 4F (Area N)
🎪 Booth N1001
Schneider Electric is also offering attendees the opportunity to register for a chance to win a VIP pass to the COMPUTEX Forum.
Secure your tour spot and chance to win a VIP pass HERE.
We look forward to connecting with customers, partners, and industry leaders at one of the year’s premier AI and infrastructure events.