AI isn’t just reshaping workloads - it’s rewriting the rules of data center design. As GPU racks push past 100 kW and power availability becomes a gating factor, the real performance bottleneck is no longer compute - it’s thermal management.
Join experts from HPE, Schneider Electric, and Motivair by Schneider Electric as they explore how next-generation power and cooling strategies are enabling the AI era.
Attendees will discover how compute, cooling, and power must be co-designed to sustain performance, reduce deployment risk, and deliver the efficiency modern AI environments demand. From silicon to chiller, each speaker will share practical insights on what future deployments may require, including:
As a global leader in liquid cooling for AI and high-performance computing, Motivair continues to shape how data centers manage heat at scale. Our proven technologies - from cold plates to coolant distribution units and rear-door heat exchangers - help operators achieve higher efficiency, reliability, and sustainability in the world’s most demanding environments.
Meet the industry leaders driving the conversation on next-generation power and cooling for AI data centers:
Tuan Hoang
Head of Cooling Technology and Product Development, Schneider Electric
Derek Schmidt
Director of Innovation, Motivair by Schneider Electric
Corey Olson
Senior HPC System Architect, Hewlett Packard Enterprise (HPE)
Whether you’re planning your first AI cluster or optimizing a global fleet, this discussion reveals how aligning compute, cooling, and power can unlock the full potential of AI infrastructure - efficiently, sustainably, and at scale.
Register here!