Motivair Corporation, a global leader in direct liquid cooling technologies for Supercomputers, High-Performance Computing and advanced IT systems announced that the United States Patent and Trademark Office (PTO) has issued Patent No. 11,483,947 for “COOLING APPARATUS WITH EXPANDING FLUID JETS”, setting a new standard for the direct liquid cooling industry and enabling semiconductor and server manufacturers to achieve optimized performance and reliability through advanced thermal technology.
Motivair’s filing protects their intellectual property in the design and manufacturing of Dynamic™ Cold Plates which offer a unique ability to target cooling on specific hot spots produced by advanced processors such as those using new Heterogenous System Architectures.
Additional benefits include a leak resistant and non-fouling design, highly desirable attributes for the server manufacturing industry as it rushes to keep up with demand from AI and cloud service providers.
“Thermal Management has become a key factor in unlocking the full potential of advanced silicon designs” Rich Whitmore, President, and CEO of Motivair said. “I’m so proud of our team’s achievement and look forward to seeing the industry benefit from this innovation.”
About Motivair Corporation
Motivair enables industry leaders to push the boundaries of what’s possible by leveraging over 30 years of insights and innovations to solve critical thermal challenges. Based in Buffalo, NY, Motivair creates, develops, and manufactures high-density computer cooling systems that help propel the worlds’ most complex and advanced technologies. Its products are featured inside the world’s first Exascale supercomputers as well as numerous Top500 supercomputers and HPC systems around the globe. For more information, visit www.motivaircorp.com