Motivair Corporation, a global leader and innovator in cooling digital infrastructure and mission critical applications, just finished a week at the 2023 AHR Expo with our industry partners, vendor partners, and customers.
We spent the week discussing the latest in liquid cooling technologies for next generation processors and reviewed new refrigerant options clients can leverage with the continued phasedown of higher-GWP HFC refrigerants.
End-to-End Liquid Cooling Systems
The rise in computer chip wattages has led to a flurry of advances in thermal technologies designed for removing heat from high-powered servers, such as those being used for Artificial Intelligence (AI) and Exascale Supercomputers.
Motivair’s End-to-End Direct Liquid Cooling Systems provide a single-sourced, direct-to-chip, liquid cooling solution for increasing CPU, GPU, and FPGA power densities.
All liquid cooling products, including Motivair’s new Dynamic Cold Plates™, are designed and manufactured in the USA for the world’s most advanced HPC, AI and Exascale-class systems.
New Refrigerant Options for Mission-Critical Chillers
Consumers and clients in 2024 will need to source and start using alternative refrigerants with the continuation of an US Environmental Protection Agency-mandated proposal focused on the phasedown of Hydrofluorocarbons.
Mandated through the American Innovation and Manufacturing (AIM) act, certain higher-GWP HFC refrigerants like R410A or R134a will be banned in most new refrigeration and air conditioning applications.
The proposal includes a 700 GWP limit on chillers and residential and light commercial air conditioning and heat pump systems from January 1, 2025.
AHR, Feb. 6-8 in Atlanta, Georgia, is the world’s largest HVACR show attracting over 100,000 attendees who are interested is seeing the industry’s latest products, technologies, and ideas.